Open.Tech’s Transceivers deliver unmatched performance and reliability for high-speed data transmission in military and aerospace applications. Compatiable with VITA 66 connectors & cables, these transceivers support a wide range of optical signals, ensuring seamless integration and exceptional signal integrity. Designed for rugged environments, our transceivers provide robust and scalable solutions for the most demanding embedded systems.
Designed for highly challenging applications where both reliability and performance are critical. Capable of speeds up to 28Gbps at distances up to 70m for the full extended temperature range. Aggregates 100Gbps over 4 channels on an efficient footprint.
The SCFF (Small Cubic Form Factor) is a ruggedized 1-channel duplex multi-mode optical transceiver operating at 850nm wavelength. It utilizes a 12-pin electrical interface in SMT (Surface Mount Technology) configuration, conforming to SFF-8431 specification for high-speed interfaces. This high-speed fiber optic transceiver is capable of data rates from 1.25Gbps up to 28.05Gbps and is designed to withstand harsh environments.
The QEPT 200G PAM4 Optical Module is a versatile and high-performance solution designed to meet the demands of today's data-intensive applications. With options for a 4-channel configuration (4TX+4RX) or 12-channel half duplex (12TX or 12RX), this high-speed fiber optic module accommodates data rates of up to 56 Gbps PAM4 and is backward compatible at 25Gbps NRZ. A QEPT 100G NRZ module provides system engineers a platform to increase data rates quickly and efficiently without redesigning the circuit card assembly.
The LEAP® On-Board Transceiver is a rugged 12-channel duplex optical transceiver capable of achieving data rates of up to 28.05Gbps per channel, up to 300Gbps in total when considering all channels. This high-speed fiber optic transceiver is optimized for multi-mode fiber at 850nm and operates effectively in a wide range of conditions
The LEAP® OBT socket has been designed to host the LEAP OBT optical modules (standard & rugged). The socket is soldered onto the PCB. The socket is soldered via the corner solder pads and the electrical interfaces consists of 225 BGA solder balls. LEAP OBT is then mounted on top of the socket with 4 screws and the electrical interfaces are ensured via the 225 LGA spring contacts.