Developed in alignment with The Open Group Sensor Open Systems Architecture™ (SOSA) technical standard, MIL-HD2 provides developers with a readily available, robust open architecture solution for tighter card pitches and chassis designs where space requirements and density are critical. These connectors are available in 3-, 4-, and 6-pair configurations, providing the MIL-embedded market with the highest count of differential pairs available today in a 3U configuration at 56Gb/s PAM 4 speeds. This series was selected by the SOSA Consortium and provides a SOSA aligned solution for nextgen switch and payload card requirements enabling the MIL-embedded market to meet next-gen performance levels while still meeting COTS requirements.
Configurations to meet SOSA/VITA 91 requirements for HD Switch
Features & Benefits:
- Highest density with 1.80mm pitch
- 4 diff, 8 column - SOSA aligned configuration
- Data rates scalable to 56Gb/s PAM4 to support system
upgrades without costly redesigns - Proprietary crosstalk reducing technologies
- 15.7mil drill compliant pin allows deeper backdrilling
- Optimized footprints
- Shielded contacts mate before signal contacts,
providing up to a 4mm minimum wipe - Embedded capacitor available
- Differential pairs 28-84 per inch (11-33 differential pairs
per centimeter) - Proven EMI and signal integrity advantages
- Improved impedance matching
- Complete solution for unique customer requirements
- Enables hot plugging
- Meets high density application requirements
