LEAP OBT Socket

The LEAP® OBT socket has been designed to host the LEAP OBT optical modules (standard & rugged). The socket is soldered onto the PCB. The socket is soldered via the corner solder pads and the electrical interfaces consists of 225 BGA solder balls. LEAP OBT is then mounted on top of the socket with 4 screws and the electrical interfaces are ensured via the 225 LGA spring contacts.

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Overview

Description:

The LEAP® OBT socket has been designed to host the LEAP OBT optical modules (standard & rugged). The socket is soldered onto the PCB.

The socket is soldered via the corner solder pads and the electrical interfaces consists of 225 BGA solder balls. LEAP OBT is then mounted on top of the socket with 4 screws and the electrical interfaces are ensured via the 225 LGA spring contacts.

Features & Benefits:

Optimized for high-speed applications (up to 28Gbps).