Products tagged with 'high density'

Developed in alignment with The Open Group Sensor Open Systems Architecture™ (SOSA) technical standard, MIL-HD2 provides developers with a readily available, robust open architecture solution for tighter card pitches and chassis designs where space requirements and density are critical. These connectors are available in 3-, 4-, and 6-pair configurations, providing the MIL-embedded market with the highest count of differential pairs available today in a 3U configuration at 56Gb/s PAM 4 speeds. This series was selected by the SOSA Consortium and provides a SOSA aligned solution for nextgen switch and payload card requirements enabling the MIL-embedded market to meet next-gen performance levels while still meeting COTS requirements.

Developed in alignment with The Open Group Sensor Open Systems Architecture™ (SOSA) technical standard, MIL-HD2 provides developers with a readily available, robust open architecture solution for tighter card pitches and chassis designs where space requirements and density are critical. These connectors are available in 3-, 4-, and 6-pair configurations, providing the MIL-embedded market with the highest count of differential pairs available today in a 3U configuration at 56Gb/s PAM 4 speeds. This series was selected by the SOSA Consortium and provides a SOSA aligned solution for nextgen switch and payload card requirements enabling the MIL-embedded market to meet next-gen performance levels while still meeting COTS requirements.